Telematics Market Global Scenario Flip Chip Technologies Market | Page 2

technologies market is segmented into 2D IC, 2.5D IC and 3D IC. On the basis of bumping technology, the market is segmented into copper pillar solder bumping, gold bumping and others. Moreover, On the basis of industry type, this market is segmented into automotive & transport, industrial, electronics, IT & telecommunications, healthcare and others. Get Sample Copy Of This Report @ http://bit.ly/2qSCpDO The geographic segment includes North America, Europe, Asia-Pacific and RoW. The U.S., Mexico and Canada are covered under North America wherein Europe covers France, Germany, UK, Spain and rest of Europe. Asia-Pacific covers China, India, Japan, South Korea and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Middle East and Africa. Major players for Flip Chip Technologies market are Samsung Electronics Co., ASE group, GlobalFoundries, Powertech Technology, UMC, Intel Corp, STATS ChipPAC, Amkor Technology, TSMCamong others. Scope of Flip Chip Technologies Market Packaging Technology Segments • • • 2D IC 2.5D IC 3D IC Bumping Technology Segments • • Copper pillar solder bumping, Gold bumping • Others Bumping Technology Segments • • • Automotive & transport Industrial Electronics