Telematics Market Global Scenario Flip Chip Technologies Market

Flip Chip Technologies Market Global Scenario, Market Size,
Outlook, Trend and Forecast, 2015 – 2024
Flip chip is the technique for interconnecting semiconductor devices, such as IC chips,
to external circuitry with solder bumps that have been dumped onto the chip pads. Flip
chip is a semiconductor interconnecting device widely used in various electronic
products such as PCs, medical devices and smartphones among others. Some of the
major benefits of flip chip are increased packaging density, reduced size & thickness,
lower cost, and improved performance of the chip, improved thermal capabilities, and
improved reliability. Major driving factors for flip chip technologies market is an
emerging internet of things and flip chip is technologically superior to the traditional wire
bond electrical connection which is another driver for this market. However, large initial
investment required for setting up new manufacturing plant and less availability of
customization options are major restraining factors for this market. Increasing growth of
demand of sensors in various electronics devices such as smart phones and personal
computers is an opportunity factor for this market.
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categories/semiconductor-electronics/flip-chip-technologies-market
The flip chip technologies market is segmented into packaging technology, bumping
technology, industry and geography. On the basis of packaging technology, the flip chip