QYR Market Research Global Flip Chip Bonder market research | Page 4

QYR
• Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the
Europe, US and Asia. As for the downstream market, China sales accounted for more than
22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading
manufacturer in global Flip Chip Bonder market with the market share of 28.64%, in
terms of revenue.
• Compared to 2015, Flip Chip Bonder market increased sales by 6.46 percent to 261.20
million USD worldwide in 2016 from 245.35 million USD in 2015. It shows that the Flip
Chip Bonder market performance is positive, despite the weak economic environment.
• The global Flip Chip Bonder market is expected to reach $445.06 million by 2022 from
$245.25 million in 2017, growing at a CAGR of 12.66% from 2017 to 2022. And China
market is expected to be the biggest market with sales market share of 25.67% in 2022.