QYR Market Research Global Flip Chip Bonder market research | Page 3

QYResearch
• The smartphone market has grown rapidly for the past few years, and
has entered into a mature phase. Meanwhile, the new driving force for
the semiconductor market shifts to the IoT market. Over 50 billions
of things will be virtually connected on the internet by 2020, and a
change can be seen in the demand for semiconductor devices. In the
future, it will be essential for big servers and supercomputers to be
larger volume and higher speed, and for mobile devices to be energy
saving as well as smaller and thinner sized. Due to these changes in the
trend of semiconductor packaging, the popularity of wireless processes,
such as flip chip and wafer-level packaging, is expected to grow. To
respond to the trend, the enterprises have been enhancing the product
lineup for the flip-chip bonder market.