Materials Science/Analysis
LMS Issue 3 | 2014
31
Quantum Leap in Thermal Analysis
M
ettler Toldeo’s Flash DSC1
represents a quantum leap in
thermal analysis technology and revolutionises rapid-scanning DSC. The DSC
1 provides heating rates of up to 2400
000 K/min and cooling rates of 240 000
K/min. The signal time constant is 1000
times shorter than that of a conventional DSC. This allows processes that
occur in milliseconds, such as injection
moulding, to be studied.
The Flash DSC 1 allows one to
prepare samples with defined structures
that occur during rapid cooling in injection moulding processes. The application of different cooling rates influences
the cr ysta llisation behav iour and
structure of the sample. The use of high
heating rates means that the material
can be analysed without interference
Precise
Imaging
T
he Horiba LabRAM HR systems
provide high spectroscopic resolution and a unique wavelength range
capability that offers both great flexibility
and high performance.
The unique high resolution mode is
ideal for subtle band analysis, such as
that for phase (crystalline/amorphous)
of proteins, weak bonding forces (such
as hydrogen bonding) and semiconductor stress measurements. In fact, it is
ideal for most applications where it is
important for the precise characterisation of position or shape of the Raman
spectral features. Band analysis with a
resolution in the order of 0.3cm-1 to 1
cm-1 is particularly suited to the high
resolution mode. Its dual capabilities also
enable more routine low/medium resolution Raman analysis and even broader
band laser-induced micro-fluorescence
or luminescence to be conducted on the
same benchtop instrument.
The LabRAM HR features:
• True confocal performance
• UV, visible and NIR capability
• An ultra low frequency module. ⚛
Wirsam Scientific
Tel:
011-482‑1060 / 021-386‑9020 /
031-709-0199 / 041-365‑2060 / 016-931‑1731
Email: [email protected]
from re-organisation processes.
Flash DSC is also the ideal tool for
studying crystallisation kinetics. The
fast response sensor feature enables the
kinetics of extremely fast reactions or
crystallisation processes to be studied.
Wide temperature range measurements
can be performed.
The heart of the Flash DSC is the
chip sensor based on Micro-ElectroMechanical Systems (MEMS) technology. In Flash DSC, the sample is
placed directly onto the MultiSTARe
chip sensor. A patented dynamic power
compensation circuit allows measurements to be performed with minimum
noise at high heating and cooling rates.
The Full Range UFS 1 sensor has
16 thermocouples and exhibits high
sensitivity and excellent temperature
resolution. The MEMS chip sensor is
mounted on a stable ceramic substrate
with electrical connections. ⚛
Microsep
Contact: Rudy Maliepaard
Tel: 011-553‑2300
Email: [email protected]