The wind and solar park operator Encavis AG has acquired two wind farms under construction in Bonnhagen ( Mecklenburg-Western Pomerania ) and Roitzsch ( Saxony- Anhalt ) from ENERTRAG SE . ENERTRAG is also responsible for the construction and operational management of wind farms . The Bonnhagen wind farm ( 24 MW ) is located 30 km west of Wismar and has been under construction since July 2024 . Grid connection is planned for September 2025 . The Roitzsch wind farm ( 12 MW ) is located 40 km northwest of Leipzig and has been under construction since April 2024 . It is expected to |
be connected to the grid as early as March 2025 . The purchase of electricity from both wind farms is secured by an EEG feed-in tariff with a term of 20 years . Details on Bonnhagen : The four Vestas V162 wind turbines , each with a generation capacity of 6 MW will generate a total of around 77 gigawatt hours ( GWh ) of electricity per year after completion . Details on Roitzsch : Two Vestas V150 wind turbines , each with a generation capacity of 6 MW . Once completed , the wind farm will supply a total of around 34 gigawatt hours ( GWh ) of electricity per year . |
TDK Corporation has announced that its subsidiary TDK Ventures , Inc . has invested in thermal interface solution innovator NovoLINC , a Pittsburgh , Pennsylvania-based company that is revolutionizing datacenter and semiconductor cooling with advanced thermal technology . NovoLINC ’ s unique approach incorporates a proprietary materials system and nanomechanical design , delivering significantly lower thermal resistance compared to conventional materials . This innovative technology addresses thermal management challenges in data centers for AI applications , where energy demands are doubling and cooling costs represent up to 40 % of the total data center energy expenditure . |
As data centers shift from air cooling to liquid cooling due to the increased power and heat generated by GPUs and high-density chips , the thermal interface between the chip and heat sink has become the critical bottleneck in cooling architecture . Traditional thermal interface solutions struggle to meet the demands of modern computing environments , where transistor sizes are decreasing , chip energy densities are increasing , and complex heterogeneous chiplet designs are emerging . NovoLINC ’ s technology directly addresses these challenges by offering innovation with high thermal conductivity and exceptionally low thermal resistance (< 1mm 2 -K / W ) with improved reliability through a highthroughput production method that ensures quality at scale . |