Global Diamond Wire Wafer Slicing Machine Market: Regional Insights
The market for diamond wire wafer slicing machine in Asia Pacific accounted for largest share
in the global market in 2017. The factor attributed to growth of the market is increasing
penetration of smartphones, increasing adoption of IoT, self-driving cars, and others. Therefore,
rising demand for consumer electronics is leading to high demand for diamond wire wafer slicing
machines. For instance, according to the Coherent Market Insights’ analysis, the number of
smartphone users in India was 292.6 million in 2016 and it has grown to 342 million in
2017. Increasing demand for smartphones and advancement in smartphone technology has led
to development of thinner and smaller ICs. This leads to high demand for diamond wire wafer
slicing machine. Hence, this factor will help in propelling growth of the market during the
forecasted period.
Moreover, presence of key manufacturers such as Samsung, Sony, LG, Toshiba, Panasonic,
Toyota, and Honda makes this region largest consumer of semiconductor ICs, which is another
major driving factor leading to high demand for diamond wire wafer slicing machine for cutting
wafer. Hence, this factor also helps in fuelling growth of the diamond wire wafer slicing machine
in this particular region.
Global Diamond Wire Wafer Slicing Machine Market: Competitive Landscape
Major players operating in the global diamond wire wafer slicing machine market are Dalian
Linton NC Machine Co., Ltd, Meyer Burger Technology AG, Slicing Tech,, Diamond Wire
Technology, Disco Corporation, Plasma Therm LLC, Tokyo Electron Ltd, ATV Technologies, and
EV Group among others.
Key players in the market are focusing on adopting product development strategy, in order to
gain competitive edge in the market. For instance, in September 2014, Dalian Linton NC machine
co., LTD. launched its new product QPJ1660B diamond wire wafer slicing machine. The
production by using this system is clean as it based on water cutting fluid technology, which
reduces environmental pollution caused by waste fluid.