machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing
machine. This machine ensures maximum material utilization while cutting and it requires low
electricity while production and this machine also not produces any slurry, which is made of
polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges
associated with the recycling of silicon wafer.
Additionally, miniaturization of electronic devices is further propelling demand for small size
chips to be incorporated in electronic devices, which in turn is driving demand for diamond wire
wafer slicing machines, globally. This is due to higher accuracy of these machines to cut a wafer
into smaller sizes as compared to conventional slicer machines. For instance, according to a
press release of Apple, Inc., in May 2018, the company announced that it is going to use a 7nm
(nanometer) chip for next generation iPhone and the processor will be named as ‘A12’ chip. This
chip will be much smaller, faster, and more efficient than 10-nanometer chips, which is being
used in current Apple devices such as iPhone 8 and iPhone X. Hence, all these factor will help in
propelling growth of the market.
Global Diamond Wire Wafer Slicing Machine Market: Key Trends
Increasing use of large size of wafer is a key trend that is being witnessed in the market. For
instance, according to a press release of SEMI, a leading semiconductor manufacturing
company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm
diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases,
it will further increase the number of dies cut from it, which in turn helps in reduction of
production cost as well as product wastage while slicing process. Therefore, as the size of wafer
increase, it need more efficient machine to provide accurate cuts, and produce more dies from
a single wafer.
Read more about study @
https://www.coherentmarketinsights.com/ongoing-insight/diamond-wire-wafer-slicing-machine-market-1864
High cost of machine is one of the major factor restraining growth of the market
High cost of diamond wire wafer slicing machines is a major restraining factor for growth of the
market. For instance, according to Coherent Market Insights’ analysis, the cost of 40HP Diamond
Wire Machine is US$ 5088.75 per unit and cost of the 60HP Diamond Wire Machine is US$
6563.75 per unit. Moreover, maintenance cost of these machines is also very high, which is
another factor hampering growth of the market.