•
40’Electro deposition/Polishing: continued 2
• -->>cont: Part of H3(less wasted ion deposition):
Pulsed ElectroPlating/Pulsed Plating/Pulsed ElectroWinning/Pulsed ElectroDeposition: When
pulse is applied there is anomalous effectiveness in energy efficiency, metal strengthening,
altering crystallization etc(frequency & waveform dependent): Used by specialty companies &
majors for specific purposes but often underused outside of semiconductor/PCB(Printed
Circuit Board)/electronics manufacturing(Plating Electronic, MacDermid Enthone,
Dynatronix+), Reversed Pulse focus for even wider range of crystallization(Dutch Reverse
Pulse Plating+): largest conglomerate types' use are often "company secrets"(General
Motors+): Effective at various nanometals/nanowires manufacturing methods with significant
use at least academic level but less often publicly discussed corporate use. 、
Also opposite of deposition use as ♛Electro Polishing/ElectroRefining to uniformly clean off
metal surface, polish, & passivate. Reduced surface adhesion. Can improve machine/medical
implants parts performance, reduce surface fouling, scale building etc. Far ahead of other
methods in detailed metal pattern cleaning,
• but same mechanics Plasma Electrolyte Polishing/Electrolyte Plasma Polishing is further far
superior: no phosphoric acid, all clean eletrolyte use, several times faster process and much
more detailed smooth quality, metal parts can stay below 100°C during process: Being the
Russian/Belarussian tech it is still hardly used outside of ex-soviets & China despite significant
machinery industry etc advantage(Plasmacraft Электролитно-плазменная, Plasotec, НПП
Технологии и Предложения, +)
linkedin.com/in/newnatureparadigm - Ben Rusuisiak: Specialty Cleantech Analysis, Vancouver, Canada
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