Three-dimensional Integrated Circuit Market
Three-dimensional Integrated Circuit Market : Overview
Three-dimensional integrated circuit ( 3D IC ) comes under the branch of microelectronics ; it is an integrated circuit which is produced by the stacking silicon wafers and dies and they are vertically interconnected using through-silicon vias . They now act as single device giving better performance at minimum power usage and smaller footprint than the traditional 2D processes . The 3D IC packaging has benefits if not of the same level but does not compromise on the form factor
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Three-dimensional Integrated Circuit Market : Segmentation
The three-dimensional integrated circuit global market is segmented into its technology , application , end user industry , and geography . On the basis of the packaging technology , the three-dimensional integrated circuit market is divided into 2.5D , 3D wafer level chip-scale packaging and 3D TSV . Based on the application the three-dimensional integrated circuit market is categorized into imaging and optoelectronics , MEMS / sensors , power , RF , logic , memory , LED , analog and mixed signal and photonics . The various end-user industries where the three-