Three-dimensional Integrated Circuit Market
Three-dimensional Integrated Circuit Market: Overview
Three-dimensional integrated circuit( 3D IC) comes under the branch of microelectronics; it is an integrated circuit which is produced by the stacking silicon wafers and dies and they are vertically interconnected using through-silicon vias. They now act as single device giving better performance at minimum power usage and smaller footprint than the traditional 2D processes. The 3D IC packaging has benefits if not of the same level but does not compromise on the form factor
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Three-dimensional Integrated Circuit Market: Segmentation
The three-dimensional integrated circuit global market is segmented into its technology, application, end user industry, and geography. On the basis of the packaging technology, the three-dimensional integrated circuit market is divided into 2.5D, 3D wafer level chip-scale packaging and 3D TSV. Based on the application the three-dimensional integrated circuit market is categorized into imaging and optoelectronics, MEMS / sensors, power, RF, logic, memory, LED, analog and mixed signal and photonics. The various end-user industries where the three-