World Semiconductor Deposition Market Drivers and Challenges Report 2 World Semiconductor Deposition Market Drivers and

Global Semiconductor Deposition Market 2016-2020

Global Semiconductor Deposition Market 2016-2020 is the latest addition to Sandlerresearch.org
industry research reports collection.
Semiconductor deposition is a process or technique of depositing a thin layer of a material on the
surface area of a wafer or substrate. The added layer acts as a conductor, an insulator barrier, or a
customized surface on which the semiconductor device pattern is etched. Materials that are used for
the deposition are silicon, filaments, silicon dioxide, carbon nanotubes, tungsten, silicon carbide, silicon
oxynitride, carbon fiber, silicon nitride, titanium nitride, silicon-germanium, and a number of high-k
dielectrics. The thickness of the deposited layer usually ranges from a few to around 100 nm. Certain
deposition techniques such as molecular beam epitaxy involve the deposition of a single layer of atom
on the surface of wafers at a time. However, in CVD technology, the wafer is exposed to one or more
volatile precursors, which react or decompose on the surface to give the desired deposit.
The analysts forecast Global Semiconductor Deposition Market to grow at a CAGR of 16.03% during the
period 2016-2020.
Covered in this Report
This report covers the present scenario and the growth prospects of the global Semiconductor
Deposition market for 2016-2020.
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Key regions
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APAC
Europe
North America

Key vendors
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Applied Materials
ASM International
Hitachi Kokusai Electric
Lam Research
Tokyo Electron