Underfill Material Market Research Report and Forecast up to 2024 Underfill Material Market - Global Industry Analys | Page 2

All key end users have been considered and potential applications have been
estimated on the basis of secondary sources and feedback from primary
respondents. Regional demand patterns have been considered while estimating the
market for various end users of underfill material in different regions. Top-down
approach has been used to estimate the underfill material market by regions.
Market numbers for global product type and application segments have been
derived using the bottom-up approach, which is cumulative of each regions
demand. The market of underfill material has been forecast based on constant
currency rates.
A number of primary and secondary sources were consulted during the course of
the study of underfill material market. Secondary sources include Factiva, World
Bank, SEMI, The Semiconductor Industry Association, World Semiconductor Trade
Statistics, Hoover’s, and company’s annual report and publications.
The report begins with an overview of the global underfill material market,
evaluating market performance in terms of revenue, key trends, drivers, and
restraints witnessed in the global market. Impact analysis of the key growth drivers
and restraints based on the weighted average model is also included in the report.
Key Players Mentioned in this Report are:
The report provides detailed competitive outlook including company profiles of key
participants operating in the global market. Some of the key players in the global
underfill material market are Henkel AG & Co. KgaA, H.B. Fuller, NAMICS
Corporation, Epoxy Technology Inc, Yincae Advanced Material, LLC, Master Bond Inc,
Zymet Inc, AIM Metals & Alloys LP, Won Chemicals Co. Ltd.
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The global Underfill material market is segmented below:
By Product Type
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
By Application
Flip Chips
Ball Grid Array (BGA)