Trends in Fan-in Wafer Level Packaging Industry 2016-2020 Oct-2016

Global Fan-in Wafer Level Packaging Market 2016-2020

Global Fan-in Wafer Level Packaging Market 2016-2020 is the latest addition to Sandlerresearch.org
industry research reports collection.
Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most
preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from
application-specific integrated circuits (ASICs) and microprocessors to electrically erasable
programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP
and is gaining popularity among fabless and foundry companies globally.
The analysts forecast Global Fan-in Wafer Level Packaging Market to grow at a CAGR of 9.63% during
the period 2016-2020.
Covered in this Report
This report covers the present scenario and the growth prospects of the global Fan-in Wafer Level
Packaging Market for 2016-2020.
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Key vendors
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Other prominent vendors
Rudolph Technologies
SEMES
SUSS MicroTec
Ultratech
FlipChip International
Key regions
APAC
North America
Europe