Trends in Chip Mounter Market 2016-2020 Trends in Chip Mounter Market 2016-2020

Global Chip Mounter Market 2016-2020

Global Chip Mounter Market 2016-2020 is the latest addition to Sandlerresearch.org industry research
reports collection.
The chip mounting technology has progressed significantly over the last two decades in terms of a
practical solution for achieving higher densities related to packaging systems. It started with the
conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and
fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted
on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with
component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal
sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly
consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the
last two decades. Thus, the chip mounting technology has moved from a big diameter to a small
diameter of space.
The analysts forecast Global Chip Mounter Market to grow at a CAGR of 8.05% during the period 20162020.
Covered in this Report
This report covers the present scenario and the growth prospects of the global Chip Mounter market for
2016-2020.
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Key regions
Americas
APAC
EMEA

Key vendors
Hitachi
Juki Corporation
Nitto Denko Corporation
Panasonic