The Silicon Review - Best Business Review Magazine Super 30 Companies of the Year 2019 | Page 15

of success: Atotech
surface plated copper distribution,
comparing high and low hole
density areas.
The latest version of Atotech’s
Cupracid ® TP series: Cupracid ®
TP3. This is an electrolytic copper
plating process for conventional
hoist type DC equipment using
soluble anodes. It provides
outstanding throwing power at high
current densities and low surface
tension for the comprehensive
wetting of BMVs and through holes.
Cupracid ® TP3 offers excellent
reliability results. It is a very
robust process with stable plating
performance after idle time.
Cupracid ® AC is for conformal
copper plating with soluble anodes.
About the CEO of
Atotech, Geoff Wild
Geoff Wild has headed
Atotech’s worldwide operations
as Chief Executive Officer (CEO)
since 2017. He is a seasoned
global chemicals industry
executive with extensive
experience in specialty
chemicals and materials for
the semiconductor and high
technology industries, including
PCBs, flat-panel displays,
and electronic components.
He also draws from his
global experience with high-
performance teams involved
in lithography, semiconductor
equipment, strategic marketing,
growth management, product
development, and mergers &
acquisitions.
It provides excellent throwing
power in both BMVs and Through
Holes at high current densities.
Cupracid ® AC is compatible with a
wide range of vertical conveyorized
systems with sparger electrolyte
agitation as well as hoist
type equipment with air agitation.
Final Finishing
Aurotech ® Plus: An Atotech
optimized ENIG process that is
designed specifically with high-
end HDI manufacturing in mind.
Dramatically reduced in nickel
corrosion, minimized extraneous
nickel plating and outstanding
soldermask mask and base material
compatibility, are all primary
benefits. Whilst technically assured;
Aurotech ® Plus offers cost saving
through extended lifetimes,
excellent distribution and process
control.
Aurotech ® HP: An ENIG process
developed especially for the high
corrosion resistance requirements
of mobile handset manufacturers.
Its nickel layer with high
phosphorous content provides
significantly better protection
versus an aggressive environment
than conventional nickel layers with
mid or low P-content. The process is
qualified and in mass production for
the world’s leading cellular phone
fabricators.
AuNic ® : A drop-in process for
existing standard ENIG lines. It
consists of five main steps: cleaning,
micro-etch, activation, electroless
nickel, and immersion Gold. The
most distinguishable feature of
AuNic ® is the introduction of the
additive AuNic ® EN C, which is
added for bath make-up and after
idle times instead of performing
dummy plating.
Desmear and Metallization
Atotech’s advanced desmear
process series Securiganth ® MV
enables outstanding cleaning and
roughening performance, and
provides the industry standard
desmear process for bare laminates
utilized in high-end IC Substrates
based on Semi-Additive Process
(SAP) technologies.
Securiganth ® E is perfectly suited
for horizontal and vertical desmear
for HDI, MLB and Flex-Rigid
production and positions Atotech
as the leading supplier of horizontal
desmear-systems (chemistry and
equipment) for state of the art HDI
production.
Oxamat: Atotech’s production-
proven regeneration system
Oxamat significantly reduces
the sludge of manganate dioxide
(MnO2) that is formed during the
desmear process. The Oxamat
system regenerates manganate to
permanganate, thereby preventing
the accumulation of sludge and
related additional chemical dosing.
Additionally, the Oxamat cuts
maintenance time in half as less
extensive cleaning cycles and make-
ups are needed.
SR
AUGUST 2019
15