The Insight Partners Redistribution Layer Material Market | Page 5

Regional Framework and
Application Insights
APAC was the leading geographic market and it is anticipated to be the
highest revenue contributor throughout the forecast period. The presence
of large semiconductor manufacturing industry in the countries like South
Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution
layer material market in this region.
The redistribution layer material market by end use is segmented into Fan-
Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced
packaging techniques integrate multiple die in a single package and thereby
ensure in reducing the device footprint. Also, integrating multiple-die in a
single package ensures, multiple functionalities of the device in a small form
factor. The majorly used advanced packaging techniques have been broadly
categorized under two segments namely Fan-out Wafer Level Packaging
(FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their
applications in these advanced level packaging where they are placed for
resolving issues related to heat dissipation, elongation of battery life, and
enhancement of the performance.