The aircraft tires market is projected to grow from USD 1.11 Billion Flip Chip Technology Market

Flip Chip Technology Market worth 31.27 Billion USD by 2022
the flip chip technology market is expected to grow from USD 19.01 Billion in
2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and
2022.
According to the new market research report "Flip Chip Technology Market by Wafer
Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC),
Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC),
Application and Geography - Global Forecast to 2022"
The flip chip technology market is driven by factors such as increasing demand for
miniaturization and high performance in electronic devices, and strong penetration in consumer
electronics sector.
Browse 66 market data tables and 71 figures spread through 157 pages and in-depth TOC
on “Flip Chip Technology Market - Global Forecast to 2022"
http://www.marketsandmarkets.com/Market-Reports/flip-chip-technology-market-
264572064.html
Early buyers will receive 10% customization on reports.
3D IC packaging technology to register the highest growth rate
On the basis of packaging technology, the flip chip technology market is segmented into 2D IC,
2.5D IC, and 3D IC packaging technology. With the semiconductor technology moving towards
integration of diverse chips, 2.5D IC packaging technology and 3D IC packaging technology are
becoming the mainstream trend in obtaining the integration objectives. Owing to the growing
demand for increasing density, higher bandwidth, and lower power, design teams are expected to
adopt 3D ICs with TSVs, which promise ‘more than Moore’ integration by packaging a great
deal of functionality into small form factors, while improving performance and reducing costs.