System-On-Package Market Segments and Forecast By End-use Industry 20 FMI | Page 3

Report
Description
Report Description
System-on-package is the latest technology in packaging of microelectronic components
in a single chip. The integration of these microelectronic components into one chip
enhances the performance as well as reduces the cost. With the increasing demand for
technologically advanced mobile devices among the consumers that are capable of
performing an array of functions in a single small product is boosting the system-onpackage technology compared to the conventional mode of packaging for
semiconductors, thus boosting the market for system-on-package market. Moreover, the
system-on-package enables efficient integration of RF (Radio Frequency) front-end
functional building blocks. The development of thin RF materials makes it easy to
integrate into the system-on-package thus fulfilling the need of efficient wireless
communication systems. With the aforementioned advantages, the global market for
system-on-package is expected to register a healthy CAGR by the end of forecast period.
Global System-On-Package Market: Drivers & Restraints

The global system-on-package market is primarily driven by the rising demand among the
semiconductor packaging industry for compact electronic devices with high performance
and cost effective packaging. The conventional packaging cost of ICs like, die level
packaging with the variation of sizes of the ICs the cost of packaging cost becomes more
compared to production cost of the ICs. Whereas, the system-on-package, is cost efficient
compared to the production cost of the ICs.