Semiconductor Chip Packaging Market Size , Share , Trends , Analysis and Forecasts To 2021
Market Research analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1 % during the period 2017-2021 .
The growth in the applications of semiconductor chips in industries such as the power , energy , medical , electric vehicles , automobiles , networking and telecommunications , consumer applications , military , aerospace and defense , motor control applications , and robotics is driving the market . Thus , the market for packaging equipment is expected to gain substantial ground during the forecast period , as packaged chips are used to improve functionality and performance of the devices in which they are applied .
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Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021 . To calculate the market size , the report considers the revenue generated from semiconductor chip packaging .
The market is divided into the following segments based on geography : Americas APAC EMEA
Global Semiconductor Chip Packaging Market 2017-2021 , has been prepared based on an in-depth market analysis with inputs from industry experts . The report covers the market landscape and its growth prospects over the coming years . The report also includes a discussion of the key vendors operating in this market .
Key vendors Applied Materials ASM Pacific Technology Kulicke & Soffa Industries TEL Tokyo Seimitsu
Market driver Growing number of fabs For a full , detailed list , view our report