Global Wire Wedge Bonder Equipment Market
by Manufacturers, Countries, Type and
Application, Forecast to 2022
No of Pages – 122
Publishing Date - June 20, 2017
Browse detailed TOC, Tables, Figures, Charts in Global Wire Wedge Bonder Equipment
Market by Manufacturers, Countries, Type and Application, Forecast to 2022 at -
http://www.360marketupdates.com/10794582
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is
also well suited for running stitch interconnects (also known as die-to-die bonding and chain
bonding), reverse bonding, and ribbon bonding.
Scope of the Report:
This report focuses on the Wire Wedge Bonder Equipment in Global market, especially in North
America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes
the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Kulicke & Soffa
ASM Pacific Technology (ASMPT)
Hesse
Cho-Onpa
F&K Delvotec Bondtechnik
Palomar Technologies
DIAS Automation
West-Bond
Hybond
TPT
Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Fully Automatic
Semi-automatic
Manual