Global Heat Shrink Wire Label Market by
Manufacturers, Countries, Type and Application,
Forecast to 2022
No of Pages – 122
Publishing Date - March 24, 2017
Browse detailed TOC, Tables, Figures, Charts in Global Heat Shrink Wire Label Market by
Manufacturers, Countries, Type and Application, Forecast to 2022 at -
http://www.360marketupdates.com/10543686
The heat shrink wire label is a film label printed on a plastic coil or plastic tubing with a dedicated
ink. In the process of labeling, when heated, the shrink label will quickly shrink along the wire outer
ring, close to the coil surface.
Scope of the Report:
This report focuses on the Heat Shrink Wire Label in Global market, especially in North America,
Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market
based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Brady
3M
Panduit
TE Connectivity
Phoenix Contact
Lapp
Lem
HellermannTyton
Brother
Seton
Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Write-On Wire Labels
Printable Wire Labels
Pre-Printed Wire Labels