Global Electronic Potting & Encapsulating
Market by Manufacturers, Countries, Type and
Application, Forecast to 2022
No of Pages – 115
Publishing Date - March 28, 2017
Browse detailed TOC, Tables, Figures, Charts in Global Electronic Potting & Encapsulating
Market by Manufacturers, Countries, Type and Application, Forecast to 2022 at -
http://www.360marketupdates.com/10555261
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal
coating to protect electronic assemblies from harsher environments to keep them functioning
properly for longer lengths of time, and/or to keep them protected from security threats. Electronic
Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These
processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
Scope of the Report:
This report focuses on the Electronic Potting & Encapsulating in Global market, especially in North
America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes
the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)