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Dubien echoed the sentiment that the technology world is in a constant state of flux, driven by global competition. He stressed the importance of continuous personal effort to stay updated, with his team constantly in contact with their R & D departments to remain current on new technologies in this rapidly growing market.
“ Weber emphasised the need for data centre owners to actively push standardisation bodies for renewed efforts in this area.”
Dubien emphasised the critical need for thermal management monitoring within data centres. " If we don ' t monitor it, we cannot manage it," he stated, stressing the importance of predictive maintenance and ongoing team awareness to future-proof data centre designs for five to six years ahead.
THE QUEST FOR STANDARDISATION IN A RAPIDLY EVOLVING FIELD A question from the audience highlighted a significant industry challenge: the lack of standardisation in direct-tochip and immersive cooling solutions, particularly concerning fittings, CDUs( Coolant Distribution Units), and overall system interoperability. Weber recalled a past era when organisations like Eurovent set rigorous standards, not just for unit aesthetics but for certified performance so that a 100 kW unit was guaranteed to deliver 100 kW. This standard, though costly, provided clear benchmarks. Its decline in popularity has led to a market where consumers struggle to verify supplier claims, occasionally receiving products that underperform. Weber emphasised the need for data centre owners to actively push standardisation bodies for renewed efforts in this area, suggesting that formal frameworks for connections( flanged, threaded, etc.) would greatly simplify planning.
Dubien offered a pragmatic perspective, stating that new direct-to-chip and immersive cooling solutions are inherently " completely customised " and not " off-the-shelf." Given that these technologies often originate from different regions such as the
US and China, he believes a common standard is unlikely in the near future. However, he anticipated that new direct-to-chip solutions would eventually conform to a standard, providing some level of interoperability.
Perrin agreed that the current market, especially with the rapid introduction of AI, does not yet allow for complete standardisation. He foresees a " stormy phase " as a period of competitive innovation driven by diverse perspectives and designs from East and West. " While a ' cookie-cutter ' approach would simplify things, technology is simply moving too fast. Yet, I want to point out that core components within CDUs, like stainless steel pipes, quick couplers and heat exchangers, are already standardised. I support the idea of data centre owners pushing suppliers for clear interface standards for their equipment to streamline integration."
Ultimately, Perrin expressed optimism that as the market matures and rises to meet the original expectations for AI, it might create opportunities for localised manufacturing and a more standardised approach. The current reliance on imports from regions focused on their own local requirements could eventually give way to a more integrated and harmonised global supply chain for advanced cooling technologies.
THE NEED FOR STANDARDISATION IN COOLING: A CHALLENGE AND ASPIRATION FOR THE DATA CENTRE INDUSTRY
Supplied by BAC
As data centres evolve to meet the demands of high-density computing, the cooling industry faces a challenge: the lack of standardised approaches for emerging technologies like direct-to-chip and immersion cooling.
While these advanced methods promise unprecedented energy efficiency and scalability, their widespread adoption is hindered by fragmented standards, proprietary systems and integration complexities. The question remains— can the industry align on common standards, and is it even possible?
“ Industry consortia such as the Open Compute Project( OCP) and ASHRAE are working to define guidelines for liquid cooling technologies.”
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RACA Journal I September 2025 www. refrigerationandaircon. co. za