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OPTIMISING SPACE USAGE Mikhail Poonsamy of DC Mech , authorised channel partner of Airedale , says a modular design allows for a build-as-you-grow approach which may match the requirement from day 1 to a fully populated data processing facility . This minimises a large capital outlay and allows the business case to be more viable . “ Couple this with the ability to adapt airflow dynamically based on realtime conditions further enhances the overall energy efficiency of the data centre , resulting in substantial cost savings over time .”
“ Cooling solutions for hyper-scale data centres , which handle large-scale IT processing , differ from those used in edge computing environments . Hyper-scale centres often require advanced , high-capacity cooling systems , while edge data centres , being smaller and more localised , may utilise more compact and flexible cooling solutions .
AireWall technology contributes significantly to energy efficiency within large hyperscale data centres .
He describes AireWall as a cooling solution that integrates fan wall technology . “ Unlike traditional systems that rely on a raised floor , the AireWall replaces a structural wall with these with an array of cooling modules . This design optimises space usage and enhances cooling efficiency by using a fan wall system to manage air distribution and temperature control more effectively in these large data halls .”
He describes another significant advancement as the adoption of liquid cooling : immersion and direct-to-chip cooling technologies . These methods represent a departure from conventional air-based cooling systems and are designed to deal with unprecedented heat loads while still aiming to lower the Power Usage Efficiency ( PUE ):
• Direct-to-chip cooling : This technique involves delivering coolant directly to the chip level from a chiller or cooling plant . By cooling the IT equipment directly at the source of heat generation , this approach addresses the challenges of high heat dissipation more effectively . The goal is to manage heat more efficiently and enhance overall cooling performance .
• Immersion cooling : This method involves submerging IT equipment in a dielectric liquid that efficiently absorbs and dissipates heat . The dielectric fluid used is non-conductive , ensuring that the equipment remains protected while being cooled . This approach is particularly beneficial for high-density computing environments where traditional air-cooling systems are less effective .
The trend towards liquid and immersive cooling is expected to grow . These technologies are poised to address the limitations
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RACA Journal I October 2024 www . refrigerationandaircon . co . za