New IP combines Flash and EEPROM elements for enhanced data retention and best-in-class operational reliability
SOFTWARE & SYSTEMS BCD-ON-SOI TECHNOLOGY
X-FAB
New IP combines Flash and EEPROM elements for enhanced data retention and best-in-class operational reliability
X-FAB Silicon Foundries SE , the leading analog / mixed-signal and specialty foundry , has just announced a major innovation in NVM data storage which draws on the company ’ s best-in-class SONOS technology . Fabricated on its highvoltage BCD-on-SOI XT011 platform , X-FAB can supply customers with an AECQ100 Grade-0 compliant 32kByte capacity embedded Flash IP , combined with an additional 4kbit EEPROM - all implemented on a 110nm semiconductor process node . Larger cuts of 64 and 128kByte flash and larger EEPROM are planned from 2025 onwards .
By taking a unique approach , both the Flash and EEPROM elements are located inside a single macro and share the necessary control circuitry . This means a much simpler arrangement is realized , leading to a smaller overall footprint for the combined elements and setting a new industry benchmark for grade-0 , 1750C capable , 32KBytes storage solution .
The Flash offers customers the most advanced data access available on the market , having the ability to read data across its entire -40 ° C to 175 ° C temperature range , with the EEPROM also able to write up to 175 ° C . The EEPROM is beneficial for applications in which there is a need to write more frequently , increasing Flash endurance and flexibility . It can also effectively act as a cache , with data programmed onto it while operating conditions are not suitable for writing to Flash , before subsequently being
written onto the Flash when temperature drops below 125 ° C . Thanks to the combination of superior robustness characteristics , continued data storage integrity and significant space savings offered , this IP is designed to fit the requirements of automotive , medical and industrial applications .
The new NVM combo IP features a 64-bit bus with 8-bit ECC for the Flash element , plus a 14-bit ECC for the EEPROM element . This enables zero-PPM error performance in deployed devices integrating it . Dedicated circuitry for easy memory access and DFT allows test times to be shortened significantly , and the associated costs minimized . BIST modules and testing services can also be supplied by X-FAB if needed .
“ Through this new NVM IP leveraging our proprietary SONOS technology , X-FAB is enabling the highest levels of reliability . This IP will provide our customers with best-in-class data retention and temperature stability for embedded systems ,” explains Thomas Ramsch , Director NVM Development at X-FAB . “ By bringing together two different NVM elements onto a single macro , one Flash and the other EEPROM , we can now deliver an embedded data storage solution capable of coping with most difficult operational situations .”
“ Through reduced-footprint and accelerated access time , our NVM combo IP will be pivotal in the development of high-logic content applications ,” adds Nando Basile , Technology Marketing Manager for NVM solutions at X-FAB . ” This will enable next-generation smart sensors and actuators CPU system designs with greater functional scope - whether this is on established CPU architectures , like ARM , or RISC-V , or on customer ’ s proprietary designs .”
For further information please visit www . xfab . com
98 PECM Issue 72