Market by Application includes transistors , sensors , lasers , photodiodes , airbag igniters , oscillating crystals , MEMS switches and others . Market by end-user industry comprises military and defense , aeronautics and space , automotive , energy and nuclear safety , medical , telecommunication and others . By geography , the market is further segmented into North America , Europe , Asia Pacific , MEA and Latin America .
Automotives are further broken down into airbag initiation , battery protection and RFID transponder operation . Energy and nuclear safety comprises electrical penetration control , oil and gas applications , fuel cell manufacturing . Medical truncates into dental applications and veterinary applications . MEM ’ s are proven devices of low-cost and reliability such as gyroscopes and resonators and excel in restricting chemically inert gases from escaping thanks to the hermetic packaging such as discrete and wafer level hermetic packaging employed . Electronic packaging is a science with hermetic ceramic packaging comprising I . C chips in Dual-Inline- Package ( DIP ) form which is further divided into two main types viz : multilayer ceramic packages ( LTCC and HTCC ) and pressed ceramic packages .
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CERM sealing enables high speed data transmission with minimum trace . H / LTCC offers significant advantages and hence indicates vertical growth in this segment . Hermeticity or hermetic packages to prevent moisture condensation from forming on IC chips and causing corrosion or occurrence of electro-chemical reactions is reason to hermetically seal the packages pursuant to military applications . Plastic encapsulate microelectronics ( PEM ’ s ) are still finding favor o account of die passivation and metallization technology but this is not the end for hermetic sealed packages with their feature-rich characteristics will find favor in electronics industry .
Hermetic connectors including DC and RF connectors machined housing and integrated hermetic electronic packaging are in use in extreme temperatures for carrying electric current in and out of the housing and disallow ingress of dust or moisture to settle on the electronic components . Connectors with specifications such as leak rate of 1x10-5 are hermetic . Target Audience includes OEM ’ s , OEM technology solution providers , Research Institutes , Market research and consulting firms and Technology Investors .
As a news article dated Aug 2016 suggests trends in food packaging have completely taken over the industry with minimization of food waste and matters with severity such as using lesser preservatives in food are here to stay . Key industry players include Teledyne microelectronics , Schott AG , Ametek , Inc , Amkor Technology , Texas Instruments Inc ., Micross Components , Inc ., Legacy Technologies , Kyocera Corporation , and Materion Corporation .