Market Research Reports - Ken Research Asia Advanced Packaging Market Segmentation, Share

Asian Advanced Packaging Industry to Blossom Owing to Technology Evolution: Ken Research
Packaging industry has long been in demand globally since a package always ensures protection
of the products which consumers buy and nowadays, this packaging is no more a necessity but
an opportunity for the markets to cater to a wider consumer base; thereby advanced packaging
techniques are being adopted recently.
The industry research report titled, “Asia Advanced Packaging Industry Situation and
Prospects Research report” is a professional and in-depth study on the current state of the
Advanced Packaging industry. The scope of this report mainly revolves around the market
dynamics, growth opportunities, driving and inhibiting factors. All the vital Advanced Packaging
information is gathered from different sources with the integrity of logic and the
comprehensiveness of contents. It offers a basic overview of the industry including significant
definitions, classifications, applications and industry chain structure. Even, the market analysis
is well carried out for the international market including development history, competitive
landscape analysis, and major regions' development status in order to generate a true image of
this industry to the users of the report.
The market is mainly split by (a) Product Types, with production, revenue, price, market share
and growth rate of each type, which further includes: Active Technology, Intelligent Technology
and Modified Atmosphere; and (b) by applications, aiming on consumption, market share and
growth rate of Advanced Packaging in each application, further segmented into- Automotive
Electronics, Consumer Electronics, Communication and Other. All the relevant development
policies and plans for the market are well evaluated taking in consideration all the important
manufacturing processes and cost structures on the basis of these types.
The Asian Advanced Packaging market caters to the countries namely- China, Japan, India,
Korea, Saudi Arabia wherein the top manufacturers, with production, price, revenue and
market share for each manufacturer are featured and namely include: ASE, SPIL, Amkor
Technology, Stats Chippac, Power tech Technology, Jiangsu Changjiang Electronics Technology,
J- Devices, UTAC, Chipmos Technologies, Chipbond Technology, STS Semiconductor, Tianshui
Huatian Technology, Nantong Fujitsu Microelectronics, Carsem Semiconductor, Walton
Advanced Engineering, Unisem, Orient Semiconductor Electronics, Formosa Advanced
Technologies and NEPES.
It has been observed that the advanced packaging industry in Asia has managed to maintain an
affirmative growth besides some hurdles over the years and accordingly, the market size has
persisted to register decent average annual growth rates year after year. Furthermore, the
analysts believe that in the years to come, the market size will expand by 2021 mainly due to
innovation that is bound to occur in the packaging sector coupled with technology which is