Market Research Report Advancements in Flip-Chip Technologies Projected t | Página 2

Table of Contents
1 Industry Overview of Flip-Chip Technologies
1.1 Flip-Chip Technologies Market Overview
1.1.1 Flip-Chip Technologies Product Scope
1.1.2 Market Status and Outlook
1.2 Global Flip-Chip Technologies Market Size and Analysis by Regions
1.2.1 United States
1.2.2 EU
1.2.3 Japan
1.2.4 China
1.2.5 India
1.2.6 Southeast Asia
1.3 Flip-Chip Technologies Market by Type
1.3.1 Copper (Cu) pillar
1.3.2 Lead (Pb)-free solder
1.3.3 Tin-lead (Sn-Pb) eutectic solder
1.3.4 Gold stud + plated solder
1.4 Flip-Chip Technologies Market by End Users/Application
1.4.1 Consumer electronics
1.4.2 Telecommunication
1.4.3 Automotive
1.4.4 Industrial sector
1.4.5 Medical devices
1.4.6 Military & aerospace
1.4.7 Others
2 Global Flip-Chip Technologies Competition Analysis by Players
2.1 Flip-Chip Technologies Market Size (Value) by Players (2015-2016)
2.2 Competitive Status and Trend
2.2.1 Market Concentration Rate
2.2.2 Product/Service Differences
2.2.3 New Entrants
2.2.4 The Technology Trends in Future
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3 Company (Top Players) Profiles
3.1 Intel
3.1.1 Company Profile
3.1.2 Main Business/Business Overview
3.1.3 Products, Services and Solutions
3.1.4 Flip-Chip Technologies Revenue (Value) (2011-2016)
3.1.5 Recent Developments
3.2 TSMC
3.2.1 Company Profile