Growing need of thin wafer semiconductors, rising technological advancements, and growing demand for material
savings projected to drive the market over the next seven years. However, thin wafer’s high volatility and susceptibility
to damage under stress make it anticipate slightly low growth over the next seven years. The primary reason for the
market to expect aforementioned challenges is owing to growing demand of ultra-thin wafer thus making them prone
to damage under cracking. The companies have formed a support system which through continuous R&D endeavors
is working to develop a stronger thin wafer dies. These developed dies are expected to assist in reducing the thickness
of packaged dies for mobile phones and in providing the efficient thermal management to electronic devices.
Thin wafers market is anticipated to report more than 50% of the overall semiconductor industry demand over the
next seven years primarily due to growing awareness and availability of ultra-thin wafers ranging from 200µm to
100µm. The industry constitutes vendors that cater to the ever-evolving needs of memory disks, wireless devices, and
consumer electronics. The market is also expected to see high growth rate owing to increasing R&D endeavors in
developing super-thin & flat wafer ranging from 100µm to 25µm, and thus obsoleting the traditionally used silicon
wafer with thickness of about 500mm
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The market is segmented by technology into wafer dicing, dry polishing, handling and thinning. The market is also
segmented by application into power devices, advanced packaging of 3D TSV LEDs, CMOS image sensors, memory &
logic and MEMS. The market further segmentation can be done on the basis of size into 125mm, 200mm, and 300mm.
The 300mm wafer is projected to witness highest growth among other segments majorly owing to its widely
acceptance and usage in semiconductor manufacturing industry. The primary reason for it to be widely used in the
semiconductor devices is because it allows manufacturers to produce a huge number of devices in a single batch. Thus,
companies have a high production capacity of 300mm wafer among all other available sizes.
Asia-Pacific is expected to account for largest market share over the forecast period owing to growing disposable
income, rising economic development, increasing demand for smartphones and other electronic devices. India, China,
South Korea, and Taiwan are projected to account for fastest growth in the region primarily due to rising use of thin
wafers in the semiconductor industry, and growing manufacturing industries that are focused on producing thin/ultra-
thin wafers.
North America and Europe are anticipated to witness significant growth over the next seven years owing to growing
demand for thin wafers in end-use industries and rising awareness of its varied applications. Particularly the US,
Germany, France, the UK, and Italy are expected to account for highest growth in the region primarily due to growing
demand for portable devices and rising consumer electronic industry. The Middle East & Africa is projected to see
considerable growth by 2022 majorly due to increasing urbanization, globalization, and industrialization. The market
has huge potential in this region primarily owing to growing economic development, and rising purchasing power
parity.