On the basis of geography, the global Radiation-Hardened Electronics Market is classified as North
America, Europe, Asia Pacific, and Rest of the World. The North American market accounts for the
major share of the global Radiation-Hardened Electronics Market. It is traced by Europe and Asia
Pacific. The largest share in the North American region is dominated by U.S.; traced by Canada and
Mexico. This large market share is contributed to the rising demand for Radiation-Hardened
Electronics components subsequently due to existence of large number of Radiation-Hardened
Electronics component manufacturers.
Some of the prominent players that fuel the growth of global Radiation-Hardened Electronics Market
include Microsemi Corporation, Atmel Corporation, Xilinx, Inc., Intersil Corporation, Texas
Instruments, Inc., BAE Systems, Honeywell Aerospace, STMicroelectronics NV, Maxwell Technologies,
Inc., and Linear Technology Corporation.
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Market Segment:
Geographically, this report is segmented into several key Regions, with production, consumption,
revenue (million USD), market share and growth rate of Radiation-Hardened Electronics in these
regions, from 2012 to 2022 (forecast), covering
• United States
• EU
• China
• Japan
• South Korea
• Taiwan
Global Radiation-Hardened Electronics market competition by top manufacturers, with
production, price, revenue (value) and market share for each manufacturer; the top players
including
• Honeywell international Inc
• Linear Technology
• BAE Systems
• Atmel Corporation