Market Forecasts and Industry Analysis Global Power Module Packaging Industry 2017 Market

Global Power Module Packaging market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including • • • • • • • • • • IXYS Corporation Star Automations DyDac Controls SEMIKRON Mitsubishi Electric Corporation Texas Instruments Incorporated Sanken Electric Co., Ltd. Fuji Electric Co. Ltd. Infineon Technologies AG SanRex Corporation Request a Sample Copy of This Report @ https://www.radiantinsights.com/research/global-power-module-packaging- industry-2017/request-sample On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into • • • • GaN Module FET Module IGBT Module SiC Module On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Power Module Packaging for each application, including • • • • • • Wind Turbines Rail Tractions Motors Electric Vehicles Photovoltaic Equipments Other See More Reports of This Category by Radiant Insights @ https://www.radiantinsights.com/catalog/electronics Follow Us:

Market Forecasts and Industry Analysis Global Power Module Packaging Industry 2017 Market | Page 2