Market Forecasts and Industry Analysis Global and Chinese 3D IC and 2.5D IC Packaging Ind

Chinese 3D IC and 2.5D IC Packaging Market
Report 2017: Radiant Insights, Inc
“This is a professional and in-depth study on the
current state of the global 3D IC and 2.5D IC
Packaging industry with a focus on the Chinese
market.”
This is a professional and in-depth study on the current state of the global 3D IC and 2.5D IC
Packaging industry with a focus on the Chinese market. The report provides key statistics on the
market status of the 3D IC and 2.5D IC Packaging manufacturers and is a valuable source of
guidance and direction for companies and individuals interested in the industry. Firstly, the report
provides a basic overview of the industry including its definition, applications and manufacturing
technology.
Then, the report explores the international and Chinese major industry players in detail. In this part,
the report presents the company profile, product specifications, capacity, production value, and 2012-
2017 market shares for each company. Through the statistical analysis, the report depicts the global
and Chinese total market of 3D IC and 2.5D IC Packaging industry including capacity, production,
production value, cost/profit, supply/demand and Chinese import/export.
Complete Report Available @ https://www.radiantinsights.com/research/global-
and-chinese-3d-ic-and-2-5d-ic-packaging-industry-2017
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