Market Analysis 2017 Study - Global Chip On Flex (COF) Market

Global Chip On Flex (COF) Market Research Report 2017
Geographically, this report is segmented into several key Regions, with production, consumption,
revenue (million USD) , market share and growth rate of Chip On Flex (COF) in these regions, from 2012
to 2022 (forecast) , covering
United States
EU
China
Japan
South Korea
Taiwan
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Global Chip On Flex (COF) market competition by top manufacturers, with production, price, revenue
(value) and market share for each manufacturer; the top players including
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics
On the basis of product, this report displays the production, revenue, price, market share and growth
rate of each type, primarily split into
Single Sided COF
Others
On the basis on the end users/applications, this report focuses on the status and outlook for major
applications/end users, consumption (sales) , market share and growth rate of Chip On Flex (COF) for
each application, including
Military
Medical
Aerospace
Electronics
Other