SOLDER REFLOW FURNACES
THE SERVOPRO MonoExact DF310E AND AquaXact 1688 WORK TOGETHER TO PROVIDE A COMPLETE GAS AND MOISTURE ANALYSIS SOLUTION FOR FURNACE ENVIRONMENTS
The ability of the SERVOPRO MonoExact DF310E and AquaXact 1688 to integrate seamlessly for the combined analysis of O 2 and moisture offers an ideal solution for many applications , including metals annealing , air separation , instrument air production and glove box purging .
One specific application is solder furnace monitoring , which requires careful , responsive , and accurate control of oxygen and moisture in the furnace environment .
In the past , printed circuit boards ( PCBs ) were cleaned with chlorofluorocarbon ( CFC ) based agents before soldering . However , the use of CFCs has now been largely eliminated because of environmental concerns .
This means PCB manufacturers must create an inert environment in the solder furnace . To ensure consistent soldering quality , it is necessary to monitor the level of O 2 in the furnace .
If high-quality solder joints are to be assured , the nitrogen in the solder furnace also needs to have a low moisture dew point , typically below -50 o C .
Servomex ’ s MonoExact DF310E digital oxygen analyzer uses Coulometric sensing technology to measure ppm O 2 . This Coulometric sensor needs only an annual span adjustment , bi-annual addition of replenishment solution , and no proactive maintenance cell replacements , all of which lowers the lifetime cost of ownership . It also offers a five-year performance guarantee not matched by any other oxygen analyzer company .
Adding the AquaXact 1688 to the MonoExact DF310E ’ s digital electronics provides an ideal solution for the exceptionally accurate monitoring of both O 2 and moisture in one system .
Unlike conventional moisture sensors , the AquaXact 1688 does not suffer from drift , so the response curve remains the same even after many months of operation at an elevated temperature .
In solder furnaces , this combination of technologies means excellent batch-tobatch solder quality and significantly reduced nitrogen consumption , with no compatibility issues caused by using sensors from different sources .
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