Product News
Ultra-Compact new packaged brazed plate heat exchanger
FlexEJ is continuing to expand its Domestic Hot Water( DHW) range and in-house expertise for the Commercial market, this time with a great range of new ultra-compact PhexPak Lite Packaged Brazed Plate Heat Exchangers – which perfectly complement FlexEJ’ s existing high-performance PhexPak product family. The new PhexPak Lite range is entirely designed and manufactured by FlexEJ in the UK and offers real value for money combining great hot water performance with state-of-the-art heat exchanger technology in an energy-efficient compact package, that can be installed wall-mounted or floor-standing for extra versatility. With six basic models to choose from, including options with or without pumps on the primary and secondary circuits, PhexPak Lite offers a suitable solution for a wide range of commercial instantaneous and semi-instantaneous DHW / HWS applications. With next-day shipping from our in-house store – there’ s never been a better time to consider upgrading your commercial hot water system to a more space and energy-efficient design.
DuPont™ Pyralux ® ML wins NPI award from Circuits Assembly
DuPont has announced that its DuPont™ Pyralux ® ML Series of double-sided metal-clad laminates, has received the 2025 NPI Award in the Laminates category. The NPI Award, presented by Circuits Assembly, a publication run by PCEA( Printed Circuit Engineering Association), recognizes the most innovative and leading new products within the electronics assembly industry, including equipment, materials, and software, as judged by an independent panel of practicing industry engineers. Launched in April 2024, Pyralux ® ML laminates are a unique addition to the extensive family of Pyralux ® laminates for flexible and rigidflex printed circuit boards( PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles( EVs), artificial intelligence( AI)-related networking and other electronic devices. The Pyralux ® ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications. Evaluations were based on a variety of criteria including creativity and innovation, compatibility with existing technology, costeffectiveness, design, expected reliability, flexibility, performance, user-friendliness, and speed / throughput. DuPont › s trailblazing Pyralux ® ML laminates contain metal alloy, such as copper-nickel( CuNi), featuring Kapton ® allpolyimide dielectric technology. The alloys provide optimized resistivity for higher heat output, reduced thermal conductivity for better control of heat transfer, and thermoelectric properties as needed for the application.