Global Semiconductor Chip Packaging Market Growth Overview Jan-2017

Global Semiconductor Chip Packaging Market 2017-2021
This report covers the present scenario and the growth prospects of the global Semiconductor Chip
Packaging Market for 2017-2021.
The analysts forecast global semiconductor chip packaging market to grow at a CAGR of 31.1% during
the period 2017-2021. The growth in the applications of semiconductor chips in industries such as the
power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer
applications, military, aerospace and defense, motor control applications, and robotics is driving the
market. Thus, the market for packaging equipment is expected to gain substantial ground during the
forecast period, as packaged chips are used to improve functionality and performance of the devices in
which they are applied.
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Global Semiconductor Chip Packaging Market 2017-2021 Research Report covers the market landscape
and its growth prospects over the coming years. The report also includes a discussion of the key vendors
operating in this market.
Foundries are using 3D packages to meet the demand from electronic product manufacturers, which are
looking to reduce the space consumed by ICs in their devices. However, the reduction in the size of the
ICs should not compromise the power-saving ability of the devices. 3D packaging involves the stacking of
multiple chips into a single stack, thereby occupying less space in a device. The emergence of this chip
packaging will provide semiconductor foundries with new business opportunities in the future, thereby
propelling the growth of the semiconductor chip packaging market during the forecast period.
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Key vendors
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
Market driver
Growing number of fabs
Market challenge
Increasing complexity of semiconductor IC designs
Market trend
Development of 3D chip packaging
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packaging-market-2017-2021.html