global Laptop and motherboard repair tutorial | Page 56

TIPS FOR A SUCESSFUL REFLOW:
Remove Chip Sealant
Most GPU Chipsets will have some sort of sealant or glue used on the edges of the chip to secure
it to the motherboard (usually red, black, or clear) I have had many successful repairs without
removing this sealant, though it is best to remove it prior to reflow to allow the flux and heat to enter.
Removal of the sealant should be done as part of the reflow process, the beginning of the process.
You begin heating the GPU without the coin-stack, holding the tip of the heat gun roughly 3 inches
away from the chip at a 45 degree angle and circling the chip while you heat it. You move around the
chip in a circular motion aiming the heat between the chip and board. The best thing to do would be to
get the Cone Tip (looks like a 3 tier cake) for the process. Use either the cone tip or an exact fit
Square tip for reflowing.
Begin heating the chip and monitor the temperature with an Infrared Laser Guided Thermometer
(if available) to a temperature of 145 degrees Celcius.
REMEMBER that you must insulate any parts or components that will melt or can be damaged
from the extreme temperature… This would include any plastic plug ports, CPU Dock, RAM DIMM
ports etc... Use tin sheets or Aluminum Foil or similar… No need to wrap the motherboard like a
Present though, just the components in the immediate area. It is also a good idea to cover the CMOS
battery with foil; or remove if the plug-in type.
Once you have reached 145 degrees celcius, you will use a mini flat head screwdriver to remove