global Laptop and motherboard repair tutorial | Page 48

As opposed to a ZIFF socket CPU where instead of solder ball – to contact pad connection, you
have pins protruding from the CPU and fitting into the matching pattern on the ZIFF CPU dock.
Thermal Over-Exposure is what creates failures in the BGA connection grid of the GPU (video
chip). The heat combined withsome GPUs using incorrect solder; will break down the solder ball
contact connection over time and over prolonged exposure to overheating conditions (clogged
fan/heat-sink).
I hold a Patent, Copyright and Trademark to this Method; this is not the same as what you
will find on YouTube… This works.
YouTube… This works. 345467488),AND PATENT-PENDING (61308926)