Four Levels of Clean, Low cost, Forgotten Water Technologies for... Four Levels of Clean, Low cost, Forgotten Water.. | Page 229

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40’Electro deposition/Polishing: continued 2
-->>cont: Part of H3(less wasted ion deposition):
Pulsed ElectroPlating/Pulsed Plating/Pulsed ElectroWinning/Pulsed ElectroDeposition: When
pulse is applied there is anomalous effectiveness in energy efficiency, metal strengthening, altering
crystallization etc(frequency & waveform dependent): Used by specialty companies & majors for
specific purposes but often underused outside of semiconductor/PCB(Printed Circuit Board)/
electronics manufacturing(Plating Electronic, MacDermid Enthone, Dynatronix+), Reversed Pulse
focus for even wider range of crystallization(Dutch Reverse Pulse Plating+): largest conglomerate
types' use are often "company secrets"(General Motors+): Effective at various nanometals/
nanowires manufacturing methods with significant use at least academic level but less often
publicly discussed corporate use.  、
Also opposite of deposition use as ♛Electro Polishing/ElectroRefining to uniformly clean off metal
surface, polish, & passivate. Reduced surface adhesion. Can improve machine/medical implants
parts performance, reduce surface fouling, scale building etc. Far ahead of other methods in
detailed metal pattern cleaning,
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but same mechanics Plasma Electrolyte Polishing/Electrolyte Plasma Polishing is further far
superior: no phosphoric acid, all clean eletrolyte use, several times faster process and much more
detailed smooth quality, metal parts can stay below 100°C during process: Being the Russian/
Belarussian tech it is still hardly used outside of ex-soviets & China despite significant machinery
industry etc advantage(Plasmacraft Электролитно-плазменная, Plasotec, НПП Технологии и
Предложения, +)
linkedin.com/in/newnatureparadigm - Ben Rusuisiak: Specialty Cleantech Analysis, Vancouver,
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