( Booth N-5345 )
Emerson to showcase packaging solutions that advance future of automation at PACK EXPO 2024
( Booth N-5345 )
Emerson : Global technology , software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago , November 3-6 ,
2024 . Advancing the boundless future of automation , Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity , sustainability and safety .
Visitors to North Building Level , Booth 5345 , can view highlights from the extensive portfolio , which includes AVENTICSTM , BransonTM , MoviconTM , PACEdge and PACSystemsTM solutions . Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation , giving manufacturers the visibility and control to solve critical challenges and ambitious goals . Attendees will learn how to accelerate net zero progress , raise overall equipment effectiveness ( OEE ) asset by asset , and empower teams with data to drive continuous improvement across the factory floor .
Presentation and event highlights :
In addition to showcasing its innovative packaging automation solutions , Emerson will also sponsor two events , the annual Packaging & Processing Women ’ s Leadership Network ( PPWLN ) breakfast and the Amazing Packaging Race .
All women who are registered for 28 FDPP - www . fdpp . co . uk
PACK EXPO Chicago are invited to the free PPWLN breakfast and program on Tuesday , November 4 , at 7:30 a . m . in West Building , Room W-375 . Following the breakfast , attendees will have the opportunity for a private show floor tour and participate in a Q & A with Lisa Propati , Vice President and General Manager of Weiler Labeling Systems , as well as other packaging executives .
As part of the Amazing Packaging Race , teams from U . S . colleges , trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO show floor .
Product highlights : Emerson Energy Manager The Energy Manager is a preengineered hardware and software solution designed to simplify
energy monitoring from quick set up to intuitive operation . Ready out of the box , the Energy Manager monitors asset energy use in real time , allowing manufacturers to gain deeper insight into energy consumption and operating costs . Through its easy-to-use dashboard , operators can access asset-specific consumption , associated costs and carbon dioxide ( CO2 ) emissions for up to 10 end points ( expandable to 50 with a license ). This level of immediate visibility can empower facility teams to reduce packaging utility costs , lower carbon dioxide emissions and maximize energy and operational efficiency . For more extensive media and utilities monitoring , the Energy Manager can be paired with the Emerson Compressed Air Manager . The combined solution provides a streamlined view of energy costs and compressed air usage across a packaging line , factory and site .
AVENTICS Series XV Pneumatic Valves
Next-generation AVENTICS Series XV Pneumatic Valves provide greater automation flexibility and optimized flow for packaging lines , including compact handling systems and complex automation solutions . Series XV valves feature multiple interoperable valve sizes , higher flow rates in a compact design and an extensive portfolio of accessories . With broad connectivity , Series XV valves support leading fieldbus protocols to simplify integration into machine control networks . They come in multiple pneumatic connection directions with metal threads , parallel wiring and aluminum base plates that make Series XV valves easier to integrate into equipment designs .
Simple to commission , engineers can use the AVENTICS online configurator to quickly design