Digital Marketing Global Thin Wafer Market | Page 3
August 28, 2019—EV Group (EVG), a leading supplier of wafer bonding and lithography
equipment for the MEMS, nanotechnology and semiconductor markets, today announced
that it has teamed up with SCHOTT, one of the world’s leading technology groups in the
areas of specialty glass and glass ceramics, to demonstrate the readiness of 300-mm (12
inch) nanoimprint lithography (NIL) for high-volume patterning of high-refractive index (HRI)
glass wafers used in the manufacture of waveguides/light guides for next-generation
augmented/mixed reality (AR/MR) headsets.
The partnership involves EVG’s proprietary SmartNIL® process and SCHOTT RealView™ high-
refractive index glass wafers, and will be carried out within EVG’s NILPhotonics®
Competence Center at the company’s headquarters in Austria. SCHOTT will showcase a 300-
mm SCHOTT RealView™ glass wafer patterned with EVG’s SmartNIL technology at the China
International Optoelectronic Expo (CIOE), to be held September 4-7 at the Shenzhen
Convention Center.
“Scaling up to 300-mm manufacturing of high-refractive index glass wafers is critical to
achieving the production volumes at the economies of scale that our customers need to
meet growing market demand for today’s and tomorrow’s leading AR/MR devices,” stated
Dr. Ruediger Sprengard, Head of Augmented Reality at SCHOTT. “Through this joint effort,
EVG and SCHOTT are demonstrating the equipment and supply-chain readiness for 300-mm
HRI glass manufacturing today.”
Significant points in table of contents:
1 Thin Wafer Product Definition
2 Global Thin Wafer Market Manufacturer Share and Market Overview
3 Manufacturer Thin Wafer Business Introduction
4 Global Thin Wafer Market Segmentation (Region Level)
5 Global Thin Wafer Market Segmentation (Product Type Level)
6 Global Thin Wafer Market Segmentation (Industry Level)
7 Global Thin Wafer Market Segmentation (Channel Level)
8 Thin Wafer Market Forecast 2019-2023
9 Thin Wafer Segmentation Product Type
10 Thin Wafer Segmentation Industry
11 Thin Wafer Cost of Production Analysis
12 Conclusion