Archetech Issue 85 2026 | Page 63

FACING THE FUTURE

HEATING, VENTILATION & INSULATION
GETTING FLOOR DESIGN RIGHT FOR FUTURE HOMES
The publication of the Future Homes Standard( FHS) is a key step for the construction industry in its journey to make net-zero ready homes a reality. Whilst many of the changes are focused on building systems, including low carbon heating and solar PV, getting envelope right will be critical to ensure these systems perform effectively and affordably. In particular, close attention should be paid to floors where low U-values can be reached relatively simply.
Floor Focus
Heat pumps generally operate most efficiently at lower flow temperatures than conventional boilers. To effectively heat homes, they rely on both reduced heat demand and larger heat emitters. Underfloor heating is therefore expected to become an increasingly common choice, making the floor not simply a structural element, but a key part of the heating system.
In this context, floor insulation becomes particularly important. Heat lost downwards represents wasted energy and unnecessary demand on the heating system. By specifying lower floor U-values, designers can reduce heat losses, improve heat pump efficiency and help support compliance.
The floor build-up itself also influences how a heating system performs in practice. Insulation specification, screed depth, thermal mass and floor finishes can all affect system responsiveness, comfort and operational efficiency. These considerations are best addressed early in the design process, where they can be optimised as part of a coordinated whole-building strategy.
Insulation thicknesses of up to 150 mm are already common on many housing developments. By specifying insulation materials with lower thermal
conductivities for floors, it may be possible to achieve improved floor U-values without having to increase thicknesses.
Phenolic insulation boards are amongst the thinnest, most thermally efficient solutions for floors with thermal conductivities as low as 0.019 W / mK. These boards are suitable for use in solid, suspended and beam and block floors and are compatible with underfloor heating systems when installed correctly.
Equally important is the quality of thermal detailing. Achieving a target U-value for the floor alone is not sufficient if avoidable thermal bridging occurs at wall-floor junctions, perimeter edges or structural penetrations. Careful detailing can make a meaningful contribution to overall performance. Some insulation manufacturers can provide pre-calculated details for common constructions, allowing low psi-values to be achieved at junctions and supporting installation with workable process sequences.
By combining low carbon heating with high levels of insulation and robust thermal detailing, specifiers should be able to ensure compliance and deliver homes that are affordable to heat.
For further information and technical support, please contact:
Tel: + 44( 0) 1544 388 601 email: info @ kingspaninsulation. co. uk Website: www. kingspaninsulation. co. uk www. linkedin. com / company / kingspan-insulationglobal /
PAGE 63- ARCHETECH