3D IC and TSV Interconnect Market by 2016 at CAGR of 16.9% Feb. 2014 | Page 2

The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. Asian region is observed to have the highest growth rate. This is mainly attributed to the presence of a huge number of companies such as Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung (South Korea), United Microelectronics Corporation (Taiwan), and more who contribute to different aspects of 3D IC manufacturing and thus help to address the challenges associated with its manufacture in a cost effective manner. About MarketsandMarkets MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world. MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. They cover thirteen industry verticals, including advanced materials, automotives and transportation, banking and financial services, biotechnology, chemicals, consumer goods, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, and telecommunications and IT. Contact: Mr. Rohan North - Dominion Plaza, 17304 Preston Road, Suite 800, Dallas, TX 75252 Tel: [phone] Email: [email protected]