and development in the sector of electronics and other industries is stimulating the demand for 2.5D IC packaging market .
Taiwan Semiconductor Manufacturing Company , Limited ( Taiwan ), Palomar Technologies ( The U . S .), Amkor Technology , Inc . ( The U . S .), Texas Instruments Inc . ( The U . S .), Samsung Electronics Co ., Ltd . ( South Korea ), Teledyne Technologies Incorporated ( The U . S .), Micron Technology , Inc . ( The U . S .), Maxim Integrated ( The U . S .), Advanced Semiconductor Engineering , Inc . ( Taiwan ), API Technologies Corporation ( The U . S .), Tektronix , Inc . ( The U . S .), Toshiba Corporation ( Japan ) and Intel Corporation ( The U . S .) are some of the key players operating in the 2.5D IC packaging market globally . Merger and acquisition and long term and short business alliances with raw material suppliers and component distributers are some of the major strategies abide by the companies in the 2.5D IC ( Integrated Circuit ) packaging market globally .
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