2021 Global Semiconductor Assembly Equipment Market Growth Analysis May 2017 | Page 3
Impact of drivers on key customer segments
Impact of drivers on key customer segments
Market challenges
Impact of challenges on key customer segments
PART 13: Market trends
Growing use of 3D packaging technology
Increase in number of OSAT vendors
M&A in packaging and assembly market
Advent of FOWLP technology
Automation in automobiles
Increased need for semiconductor memory devices
PART 15: Appendix
List of abbreviations