2021 Global Semiconductor Assembly Equipment Market Growth Analysis May 2017

Global Semiconductor Assembly Equipment Market 2017-2021
Global Semiconductor Assembly Equipment Market report covers the present scenario and the growth
prospects of the industry for 2017-2021. To calculate the market size, the report considers the sales of
assembly equipment to end-users. The analysts forecast global Semiconductor Assembly Equipment
market to grow at a CAGR of 3.57% during the period 2017-2021.
Other Prominent Vendors
Other Prominent Vendors in the market are Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek
Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, West Bond.
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Market driver
Incentives and discounts for long-term customers.
Market challenge
High-investment market.
Market trend
Growing use of 3D packaging technology.
Key vendors
The key players in the Semiconductor Assembly Equipment Market are ASM Pacific Technology, Kulicke
& Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu.
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The report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on
an in-depth market analysis with inputs from industry experts. This report covers the market landscape
and its growth prospects over the coming years. The report also includes a discussion of the key vendors
operating in this market.
Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the
back-end process of chip formation. Chip assembly basically involves attaching or joining two or more
semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used
for making interconnects between an IC or any other semiconductor device during assembly. This
connection ensures the flow of electricity in the semiconductor device.
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semiconductor-assembly-equipment-market-2017-2021.html